Test and Measurement World Terminology Section

One Stop For Your Test and Measurement Need

Soldering vs Brazing-Difference between Soldering and Brazing

This page compares Soldering vs Brazing and mentions difference between Soldering and Brazing. The definitions of both soldering and brazing are also described.

Introduction:
• They are used to join dissimilar metals and non metals.
• Soldering and brazing provide permanent joint to bond metal pieces.
• Soldering and brazing process lie some where in between fusion welding and solid state welding.
• They use low temperature compare to welding.
• They have less thermal distortion and less chance of damage.

Soldering

Soldering

• The figure-1 depicts soldering process.
• Soldering is a metal joining process where the melting temperature of the filler metal is relatively low.
• The most common type of filler metal used in soldring is alloy of tin and lead in 60:40 proportion.
• It occurs at temperature of around 400oC.
• Metal parts are not held very tightly during the soldering process.

Brazing

Brazing

• The figure-2 depicts brazing process.
• The brazing is a metal joining process where the melting temperature of the filler metal is usually above the 450oC.
• Brass alloys are commonly used in brazing.
• As mentioned it occurs at temperature above 450oC.
• Metal parts are held very tightly during the brazing process.

Difference between Soldering and Brazing

In both soldering and brazing, filler material will enter into the gap between workpiece by means of capillary action. Following table mentions difference between soldering and brazing.

Soldering Brazing
Filler material is an alloy of lead and tin, which is known as solder. Filler material is an alloy of (copper and zinc), (Cu and silver) or (Cu and aluminium). They are known as spelter.
The flux used in soldering is zinc chloride (ZnCl2) and HCL. The flux used is borax and boric acids.
The strength of joint is less in comparison to brazing. The strength is more.
Joints are affected by high temperature and pressure. High temperature and pressure do not affect the joint.
Equipment cost is very low. Equipment cost is more.
It is widely used in electronics industry for various applications. It is used in pipe fitting where leak proof joints are required for intricate light weight components.


What is difference between or comparison between

Following links mention difference or comparison between various equipments and terms:
comparison between SPI and I2C
difference between PXI and PCI
Microscope vs Telescope
Amplitude Modulation vs Angle Modulation
difference between modem and router
Air Fuel Ratio Sensor vs O2 Sensor
Radiometer vs Spectrometer vs Spectroradiometer
Clamp meter vs digital multimeter
Colorimeter vs Spectrophotometer
difference between Prism and Grating
difference between Venturi meter and Orifice meter
difference between Lux and Lumens




Share this page

Translate this page

Latest Posts